- 您现在的位置：买卖IC网 > Sheet目录119 > 1N5821RLG (ON Semiconductor)DIODE SCHOTTKY 30V 3A DO201AD
    1N5820, 1N5821, 1N5822 http://onsemi.com 6 0.7 1.0 7.0 103.0 0.1 IF(AV), AVERAGE FORWARD CURRENT (AMP) 10 7.0 5.0 0.7 0.5 0.1 5.0 P 0.2 0.3 0.5 2.0 , AVERAGE POWER DISSIPATION (WATTS) F(AV) 3.0 2.0 1.0 0.3 0.2 Figure 6. Forward Power Dissipation 1N5820-22 dc SQUARE WAVE TJ ≈ 125 °C SINE WAVE I(FM) I(AV) Capacitive Loads 5.0 10 20 TA(A) TA(K) TL(A) TC(A) TJ TC(K) TL(K) PD RS(A) RL(A) RJ(A) RJ(K) RL(K) RS(K) NOTE 4 - APPROXIMATE THERMAL CIRCUIT MODEL Use of the above model permits junction to lead thermal resistance for any mounting configuration to be found. For a given total lead length, lowest values occur when one side of the rectifier is brought as close as possible to the heat sink. Terms in the model signify: TA = Ambient Temperature T C = Case Temperature TL = Lead Temperature T J = Junction Temperature RS = Thermal Resistance, Heatsink to Ambient RL = Thermal Resistance, Lead-to-Heatsink RJ = Thermal Resistance, Junction-to-Case PD = Total Power Dissipation = P F + P R PF = Forward Power Dissipation PR = Reverse Power Dissipation (Subscripts (A) and (K) refer to anode and cathode sides, respectively.) Values for thermal resistance components are: RL = 42 °C/W/in typically and 48°C/W/in maximum RJ = 10 °C/W typically and 16°C/W maximum The maximum lead temperature may be found as follows: TL = T J(max) T JL where T JL R JL · P D TYPICAL VALUES FOR RJA IN STILL AIR Data shown for thermal resistance junction-to-ambient (RJA) for the mountings shown is to be used as typical guideline values for preliminary engineering, or in case the tie point temperature cannot be measured. 1 2 3 Mounting Method Lead Length, L (in) 1/8 1/4 1/2 3/4 RJA 50 51 53 55 °C/W °C/W °C/W 58 59 61 63 28 NOTE 5 — MOUNTING DATA Mounting Method 1 P.C. Board where available copper surface is small. Mounting Method 3 P.C. Board with 2-1/2, x 2-1/2, copper surface. BOARD GROUND PLANE VECTOR PUSH-IN TERMINALS T-28 Mounting Method 2 LL LL L = 1/2″ |